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Advanced Packaging And Manufacturing Technology Based On Adhesion Engineering: Wafer-level Transfer Packaging And Fabrication Techniques Using . (springer Series In Advanced Manufacturing)
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| Full title: | Advanced Packaging And Manufacturing Technology Based On Adhesion Engineering: Wafer-level Transfer Packaging And Fabrication Techniques Using . (springer Series In Advanced Manufacturing) |
|---|---|
| ISBN: | 9783319778716 |
| ISBN 10: | 3319778714 |
| Authors: | Seonho Seok |
| Publisher: | Springer |
| Edition: | 1 |
| Binding: | Hardcover |
| Published on: | 2018 |
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