All books / Book
3D IC Integration and Packaging
| Full title: | 3D IC Integration and Packaging |
|---|---|
| ISBN: | 9780071848060 |
| ISBN 10: | 0071848061 |
| Authors: | Lau, John |
| Publisher: | McGraw-Hill Education |
| Edition: | 1 |
| Num. pages: | 480 |
| Binding: | Hardcover |
| Language: | en_US |
| Published on: | 2015-08-27T00:00:01Z |
Read the reviews and/or buy it on Amazon.com
